SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Connectors of this type have contacts arranged in linear rows and an outline which is generally rectangular, rather than circular. They are used for creating pluggable connections directly between printed circuit boards without use of wire or cable, and can provide a large number of electrical connections in a relatively small space. For this reason they are commonly used to connect components of space-constrained systems.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() 61082-181002 $3.53 | Amphenol ICC (FCI) | CONN RCPT 180POS SMD GOLD | Tape & Reel (TR) | Surface Mount | BergStak® 0.80mm | ||
![]() 61082-181009 $5.26 | Amphenol ICC (FCI) | CONN RCPT 180POS SMD GOLD | Tube | Surface Mount | BergStak® 0.80mm | ||
![]() 61082-181102 $4.06 | Amphenol ICC (FCI) | CONN RCPT 180POS SMD GOLD | Tape & Reel (TR) | Surface Mount | BergStak® 0.80mm | ||
![]() 61082-181109 $4.54 | Amphenol ICC (FCI) | CONN RCPT 180POS SMD GOLD | Tube | Surface Mount | BergStak® 0.80mm | ||
| Amphenol ICC (FCI) | CONN RCPT 180POS SMD GOLD | Tube | Surface Mount | BergStak® 0.80mm | |||
| Amphenol ICC (FCI) | CONN RCPT 180POS SMD GOLD | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | BergStak® 0.80mm | |||
![]() 61082-181409LF $4.04 | Amphenol ICC (FCI) | CONN RCPT 180POS SMD GOLD | Tube | Surface Mount | BergStak® 0.80mm | ||
| Amphenol ICC (FCI) | CONN RCPT 180POS SMD GOLD | Tape & Reel (TR) | Surface Mount | BergStak® 0.80mm |
QTH-060-03-L-D-LCView Product
SEAMP-20-02.0-S-06-TRView Product
716612568View Product
2039550201View Product
AXT624124AView Product
BTS-075-01-H-DView Product
B3291B7L111240E100View Product
QTH-020-04-L-D-DP-A-KView Product
QRM8-052-05.0-L-D-A-K-TRView Product
SEAM-50-09.0-S-08-2-A-K-TRView Product
ERM8-070-01-L-D-EM2-TRView Product
ADM6-30-08.5-L-4-0-A-TRView Product
Compare SPST and SPDT toggle switches, understand AC/DC ratings, and follow wiring examples. Check contact action, mounting and parts in the ChipApex catalog.
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More
WILMINGTON, Mass. – August 11, 2026 — Analog Devices, Inc. (NASDAQ: ADI), the global leading supplier of high-performance analog, mixed-signal and digital signal processing…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More
Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More