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Products in the modular embedded processor family integrate a microcontroller, microprocessor, digital signal processor, FPGA, or other such computational device together with support components such as memory, power management, timing, and other items necessary for their operation. They are suitable and intended for integration into an end product, and offer product developers access to modern computational and interface capabilities without necessity of high speed hardware design experience.
RK3328-SOM-1GView Product
SOMDM3730-32-1880AKIRView Product
TE0890-01-25-1CView Product
QC-DB-V10004BView Product
TE0722-02IView Product
SOMOMAP3530-12-1782JFIRView Product
5749-PX-4AA-RIView Product
EC-V-H264-8B-30-1080-MXC-ZLView Product
FORLINX-FET1028A-C+152GOE16M8GIA12View Product
SCM-20100E-BView Product
FORLINX-FETT507-C+152GSE8GIA10View Product
101-0453View Product
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
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An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
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In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
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Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
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Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
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Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
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Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
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Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
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Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
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Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
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The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
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Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
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