SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

This type of header contains male pins within a plastic base and is meant to be mated with a rectangular cable connector or a female socket header for board-to-board connection. These come in a variety of position and pitch options, with some having a breakaway option to manually change position count with ease. Some are shrouded with 1 to 4 walls or unshrouded. Mounting types include panel mount, board edge, stacking, surface mount, and through-hole.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Amphenol ICC (FCI) | CONN HEADER R/A 4POS 2.54MM | Bag | Through Hole, Right Angle | BERGSTIK® | -65°C ~ 130°C | ||
| Amphenol ICC (FCI) | CONN HEADER R/A 6POS 2.54MM | Bag | Through Hole, Right Angle | BERGSTIK® | -65°C ~ 130°C | ||
| Amphenol ICC (FCI) | CONN HEADER R/A 36POS 2.54MM | Bag | Through Hole, Right Angle | BERGSTIK® | -65°C ~ 130°C | ||
| Amphenol ICC (FCI) | CONN HEADER R/A 6POS 2.54MM | Bag | Through Hole, Right Angle | BERGSTIK® | -65°C ~ 130°C | ||
| Amphenol ICC (FCI) | CONN HEADER R/A 36POS 2.54MM | Bag | Through Hole, Right Angle | BERGSTIK® | -65°C ~ 130°C | ||
| Molex | CONN HEADER VERT 2POS 5.08MM | Bulk | Through Hole | SPOX 5279 | - | ||
| Molex | CONN HEADER VERT 3POS 5.08MM | Bulk | Through Hole | SPOX 5279 | - | ||
| Molex | CONN HEADER VERT 4POS 5.08MM | Bulk | Through Hole | SPOX 5279 | - |
SL 10 SMD 130 9 Z B TRView Product
TSW-105-25-T-D-NAView Product
878331260View Product
A-WBP-B001EA-05SR01View Product
78299-424HLFView Product
SL 11 SMD 062 58 ZView Product
800-40-043-20-001000View Product
SMH100-LPPE-D17-ST-BKView Product
TMM-130-04-S-DView Product
901310783View Product
HTSW-103-25-T-S-LLView Product
MTMM-111-02-S-D-125View Product
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read MoreDutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
Learn what an integrated circuit is, how ICs work, the main types and the specs to check before choosing a part for your design…
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read More
WILMINGTON, Mass. – August 11, 2026 — Analog Devices, Inc. (NASDAQ: ADI), the global leading supplier of high-performance analog, mixed-signal and digital signal processing…
Read More