SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Memory is a semiconductor device that is used as data storage device on an integrated circuit. These devices are available in several formats CBRAM, DRAM, EEPROM, EERAM, EPROM, Flash, FRAM, NVSRAM, PCM (PRAM), PSRAM, RAM, and SRAM in either Non-Volatile or Volatile. These devices memory sizes range from 64 b to 6 Tb with the interface being I2C, MMC, Parallel, eMMC, Serial, Single Wire, SPI, UFS, Xccela Bus, and 1-Wire.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Renesas Electronics Corporation | IC SRAM 576KBIT PARALLEL 208PQFP | Tray | 208-PQFP (28x28) | Surface Mount | - | 0°C ~ 70°C (TA) | |
![]() 70V3569S4DRG $91.73 | Renesas Electronics Corporation | IC SRAM 576KBIT PARALLEL 208PQFP | Tray | 208-PQFP (28x28) | Surface Mount | - | 0°C ~ 70°C (TA) |
![]() 70V3569S5BC $79.46 | Renesas Electronics Corporation | IC SRAM 576KBIT PAR 256CABGA | Tray | 256-CABGA (17x17) | Surface Mount | - | 0°C ~ 70°C (TA) |
![]() 70V3569S5BC8 $66.18 | Renesas Electronics Corporation | IC SRAM 576KBIT PAR 256CABGA | Tape & Reel (TR) | 256-CABGA (17x17) | Surface Mount | - | 0°C ~ 70°C (TA) |
![]() 70V3569S5BCI $87.41 | Renesas Electronics Corporation | IC SRAM 576KBIT PAR 256CABGA | Tray | 256-CABGA (17x17) | Surface Mount | - | -40°C ~ 85°C (TA) |
![]() 70V3569S5BCI8 $72.79 | Renesas Electronics Corporation | IC SRAM 576KBIT PAR 256CABGA | Tape & Reel (TR) | 256-CABGA (17x17) | Surface Mount | - | -40°C ~ 85°C (TA) |
![]() 70V3569S5BF $82.99 | Renesas Electronics Corporation | IC SRAM 576KBIT PAR 208CABGA | Tray | 208-CABGA (15x15) | Surface Mount | - | 0°C ~ 70°C (TA) |
![]() 70V3569S5BF8 $66.18 | Renesas Electronics Corporation | IC SRAM 576KBIT PAR 208CABGA | Tape & Reel (TR) | 208-CABGA (15x15) | Surface Mount | - | 0°C ~ 70°C (TA) |
5962-8855206UAView Product
24LC32AF-I/PView Product
70V3579S5BFIView Product
MT47H64M16HR-3 AAT:HView Product
AS7C34096A-20JCNTRView Product
24CW1280-I/STView Product
IS42S32160F-7TLView Product
IS46DR16160B-3DBLA2-TRView Product
AT45DB011D-DWFView Product
IS42S32400J-7BLView Product
CY22E016L-SZ45XIView Product
7164S20TPGIView Product
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Recently, the global electronic components market has been constantly evolving, and different regions and enterprises have witnessed new moves in aspects such as technological…
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read MoreRecently, global semiconductor manufacturers have been constantly taking actions and presenting numerous new developments in aspects such as process technology and product research and…
Read More
See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More