Diode Arrays FST10030 product image

FST10030

$46.53
  • Description:DIODE MOD SCHOT 30V 100A TO249AB
  • Series:-

SKU:4ad0fb82b49b Category: Brand:

  
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FST10030 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists GeneSiC Semiconductor. Its product description is DIODE MOD SCHOT 30V 100A TO249AB. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for FST10030

  • Description:DIODE MOD SCHOT 30V 100A TO249AB
  • Series:-
  • Mfr:GeneSiC Semiconductor
  • Package:Bulk
  • Diode Configuration:1 Pair Common Cathode
  • Technology:Schottky
  • Voltage - DC Reverse (Vr) (Max):30 V
  • Current - Average Rectified (Io) (per Diode):100A
  • Voltage - Forward (Vf) (Max) @ If:650 mV @ 100 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:2 mA @ 20 V
  • Operating Temperature - Junction:-
  • Mounting Type:Chassis Mount
  • Package / Case:TO-249AB
  • Supplier Device Package:TO-249AB
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for FST10030

FST10030

Diode Arrays Overview

The FST10030 is a silicon power Schottky diode module manufactured by GeneSiC Semiconductor. It features an average forward current of 100 A per package and a repetitive peak reverse voltage of 30 V. The device operates within a junction temperature range of -55 °C to +150 °C. Electrical characteristics include a maximum instantaneous forward voltage of 0.70 V and a peak forward surge current of 1000 A. Thermal resistance from junction to case is 1.0 °C/W per leg.

Diode Arrays Feature Summary

  • High surge capability with robust non-repetitive forward current handling
  • Electrically isolated to the mounting plate for simplified thermal management
  • Not sensitive to electrostatic discharge, facilitating safe handling

Diode Arrays Applications

  • DC-DC converter circuits requiring high efficiency
  • Free-wheeling rectification in motor drive systems
  • Power supply output rectification stages

Diode Arrays Procurement Notes

Verify the specific part marking against the datasheet terminal configuration diagram to ensure correct pinout alignment during assembly. Confirm that the thermal interface material selection matches the specified junction-to-case thermal resistance requirements for your heat sink design. Ensure the operating environment stays within the stated temperature limits to maintain reliability.

Diode Arrays Selection Notes

Select this component when a 30 V blocking voltage and 100 A continuous current rating are required in a TO-249AB package. Consider the low forward voltage drop for efficiency optimization. Evaluate the thermal resistance specifications against your system's cooling capabilities to determine if additional heatsinking is necessary for sustained operation at full load.

Diode Arrays Part Context

This device belongs to the FST100 series of silicon power Schottky diodes from GeneSiC Semiconductor. The series includes variants with different reverse voltage ratings, such as the FST10020 and FST10040, sharing identical current and thermal characteristics. These modules are designed for high-performance power conversion applications where low loss and ruggedness are critical.

Diode Arrays Replacement Considerations

Direct substitutes within the same family include the FST10020 (20 V) and FST10040 (40 V), provided the voltage margin allows. Cross-manufacturer replacements must match the 100 A current, 30 V rating, TO-249AB package, and thermal resistance values.

Diode Arrays FAQ

What is the maximum instantaneous forward voltage for the FST10030?

The maximum instantaneous forward voltage is 0.70 V.

Is the FST10030 sensitive to electrostatic discharge?

No, the device is not ESD sensitive.

What is the thermal resistance from junction to case?

The thermal resistance from junction to case is 1.0 °C/W per leg.

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