MBR30035CTR

Diode Arrays Overview

The GeneSiC Semiconductor MBR30035CTR is a silicon power Schottky diode module rated for a repetitive peak reverse voltage of 35 V and an average forward current of 300 A per package. It utilizes a Twin Tower package with screw mount installation. The device features a maximum forward voltage of 0.70 V at 300 A and a thermal resistance junction-to-case of 0.40 °C/W per leg. Operating and storage temperatures range from -55 °C to +150 °C, with a peak forward surge current capability of 2000 A.

Diode Arrays Feature Summary

• High surge current capability
• Twin Tower package design
• Not ESD sensitive

Diode Arrays Applications

• Power electronics rectification
• DC-DC converter circuits
• Freewheeling applications in motor drives

Diode Arrays Procurement Notes

Verify the specific part number against official manufacturer documentation to confirm availability and exact specifications. Check for any discontinuation notices or lifecycle status updates directly from the supplier. Ensure compatibility with existing thermal management systems and mounting hardware requirements before procurement.

Diode Arrays Selection Notes

Select this component based on its 35 V reverse voltage rating and 300 A continuous current capacity. Consider the 0.40 °C/W thermal resistance for heat sink sizing. Verify that the Twin Tower package fits the mechanical constraints of the target assembly. Confirm the operating temperature range meets environmental requirements.

Diode Arrays Part Context

This component belongs to the MBR300 series of silicon Schottky diode modules from GeneSiC Semiconductor. The series includes variants with different reverse voltage ratings ranging from 20 V to 40 V. All models share similar current ratings and package styles, differing primarily in their blocking voltage capabilities.

Diode Arrays Replacement Considerations

Compatible substitutes include other MBR300 series parts such as MBR30030CT or MBR30040CT, provided the voltage ratings align with circuit requirements. Ensure the replacement maintains the same Twin Tower package and terminal configuration for direct interchangeability.