SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Products in this family are interconnect products used in conjunction with Flat Flexible Cable (FFC) and Flexible Printed Circuit (FPC) materials and are predominantly of the sort which perform a cable-to-board interconnect function, being mounted to a printed circuit board, and providing both electrical connection and mechanical retention for an inserted FFC or FPC cable.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() 2203630800 $2.10 | Molex | 0.4 FPC E/O ZIF EMBT PKG 80CKT | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | Easy-On FD4P | -40°C ~ 105°C | |
![]() 2203631200 $4.84 | Molex | 0.4 FPC E/O ZIF EMBT PKG 120CKT | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | Easy-On FD4P | -40°C ~ 105°C | |
![]() 2213780067 $2.05 | Molex | 0.5 FPC BF H=0.9 PKG PFAS FREE 6 | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | Easy-On BT5P | -40°C ~ 85°C | |
| Molex | CONN FFC BOTTOM 3POS 2.54MM R/A | Tray | Through Hole, Right Angle | 5229 | -40°C ~ 105°C | ||
| Molex | CONN FFC BOTTOM 4POS 2.54MM R/A | Tray | Through Hole, Right Angle | 5229 | -40°C ~ 105°C | ||
| Molex | CONN FFC BOTTOM 5POS 2.54MM R/A | Tray | Through Hole, Right Angle | 5229 | -40°C ~ 105°C | ||
| Molex | CONN FFC BOTTOM 6POS 2.54MM R/A | Tray | Through Hole, Right Angle | 5229 | -40°C ~ 105°C | ||
| Molex | CONN FFC BOTTOM 7POS 2.54MM R/A | Tray | Through Hole, Right Angle | 5229 | -40°C ~ 105°C |

Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read More
Compare RC, crystal and MEMS oscillator circuits. Check ppm, jitter, load capacitance, startup margin and output compatibility before choosing a clock source.
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
Compare SPST and SPDT toggle switches, understand AC/DC ratings, and follow wiring examples. Check contact action, mounting and parts in the ChipApex catalog.
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read MoreSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
Read More