SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

This type of header contains male pins within a plastic base and is meant to be mated with a rectangular cable connector or a female socket header for board-to-board connection. These come in a variety of position and pitch options, with some having a breakaway option to manually change position count with ease. Some are shrouded with 1 to 4 walls or unshrouded. Mounting types include panel mount, board edge, stacking, surface mount, and through-hole.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| TE Connectivity AMP Connectors | CONN HEADER VERT 12POS 2.54MM | Bulk | Through Hole | AMPMODU Mod II | - | ||
| TE Connectivity AMP Connectors | CONN HEADER VERT 14POS 2.54MM | Bulk | Through Hole | AMPMODU Mod II | - | ||
![]() 1-87465-1 $8.25 | TE Connectivity AMP Connectors | CONN HEADER VERT 10POS 2.54MM | Tray,Tray | Through Hole | AMPMODU Mod II | - | |
| TE Connectivity AMP Connectors | CONN HEADER VERT 12POS 2.54MM | Tray | Through Hole | AMPMODU Mod II | - | ||
![]() 1-87465-5 $5.05 | TE Connectivity AMP Connectors | CONN HEADER VERT 14POS 2.54MM | Tray | Through Hole | AMPMODU Mod II | - | |
![]() 1-87465-6 $5.59 | TE Connectivity AMP Connectors | CONN HEADER VERT 15POS 2.54MM | Tray | Through Hole | AMPMODU Mod II | - | |
| TE Connectivity AMP Connectors | CONN HEADER VERT 17POS 2.54MM | Tray | Through Hole | AMPMODU Mod II | - | ||
| TE Connectivity AMP Connectors | CONN HEADER VERT 18POS 2.54MM | Tray | Through Hole | AMPMODU Mod II | - |
TSW-204-18-F-SView Product
SL 5 525 33 ZView Product
929647-03-17-EUView Product
929836-09-29View Product
CWN-370-10-0021View Product
64901429522View Product
SLY 7 SMD 036 12 G SMView Product
M20-9742146View Product
TSM-111-02-L-DH-SL-K-TRView Product
TFC-135-22-L-D-AView Product
SL 10 SMD 104 34 S SMView Product
SL 15 SMD 182 23 GView Product
Monolithic Power Systems (MPS), a global leader in analog and mixed-signal semiconductors, has notified its distribution partners of an upcoming price increase for selected…
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More
Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read More