SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

This type of header contains male pins within a plastic base and is meant to be mated with a rectangular cable connector or a female socket header for board-to-board connection. These come in a variety of position and pitch options, with some having a breakaway option to manually change position count with ease. Some are shrouded with 1 to 4 walls or unshrouded. Mounting types include panel mount, board edge, stacking, surface mount, and through-hole.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Amphenol ICC (FCI) | CONN HEADER R/A 7POS 2.54MM | Bag | Through Hole, Right Angle | BERGSTIK® II | - | ||
| Amphenol ICC (FCI) | CONN HEADER R/A 7POS 2.54MM | Bag | Through Hole, Right Angle | BERGSTIK® II | - | ||
| Amphenol ICC (FCI) | B/S R/A P0L4 | Bulk | Through Hole, Right Angle | BERGSTIK® II | - | ||
| Amphenol ICC (FCI) | CONN HEADER SMD 10POS 2.54MM | Tape & Reel (TR) | Surface Mount | BERGSTIK® | - | ||
| Amphenol ICC (FCI) | CONN HEADER | Bag | Surface Mount | BERGSTIK® | - | ||
| Amphenol ICC (FCI) | CONN HEADER R/A 4POS 2.54MM | Bulk | Through Hole, Right Angle | BERGSTIK® II | - | ||
| Amphenol ICC (FCI) | CONN HEADER R/A 5POS 2.54MM | Bag | Through Hole, Right Angle | BERGSTIK® II | - | ||
![]() 10118884-405002LF $0.14 | Amphenol ICC (FCI) | CONN HEADER R/A 5POS 2.54MM | Bag | Through Hole, Right Angle | BERGSTIK® II | - |
FTSH-116-01-L-DH-A-TRView Product
800-10-058-20-001000View Product
TSM-104-01-LM-DV-LC-P-TRView Product
802-40-028-10-004000View Product
68645-043View Product
89125-012View Product
TMM-115-01-F-D-SM-PView Product
TMS-105-52-T-S-002View Product
436500803View Product
2-440054-2View Product
TEM-130-02-03.0-FG-D-WT-TRView Product
MTSW-116-22-L-D-400View Product
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More
WILMINGTON, Mass. – August 11, 2026 — Analog Devices, Inc. (NASDAQ: ADI), the global leading supplier of high-performance analog, mixed-signal and digital signal processing…
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More