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Memory is a semiconductor device that is used as data storage device on an integrated circuit. These devices are available in several formats CBRAM, DRAM, EEPROM, EERAM, EPROM, Flash, FRAM, NVSRAM, PCM (PRAM), PSRAM, RAM, and SRAM in either Non-Volatile or Volatile. Memory sizes range from 64 b to 6 Tb with the interface being I2C, MMC, Parallel, eMMC, Serial, Single Wire, SPI, UFS, Xccela Bus, and 1-Wire.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Renesas Electronics Corporation | IC SRAM 4.5MBIT PARALLEL 208PQFP | Tray | 208-PQFP (28x28) | Surface Mount | - | 0°C ~ 70°C (TA) | |
![]() 70V7319S133BC $140.87 | Renesas Electronics Corporation | IC SRAM 4.5MBIT PAR 256CABGA | Tray | 256-CABGA (17x17) | Surface Mount | - | 0°C ~ 70°C (TA) |
![]() 70V7319S133BC8 $117.40 | Renesas Electronics Corporation | IC SRAM 4.5MBIT PAR 256CABGA | Tape & Reel (TR) | 256-CABGA (17x17) | Surface Mount | - | 0°C ~ 70°C (TA) |
![]() 70V7319S133BF $141.25 | Renesas Electronics Corporation | IC SRAM 4.5MBIT PAR 208CABGA | Tray | 208-CABGA (15x15) | Surface Mount | - | 0°C ~ 70°C (TA) |
![]() 70V7319S133BF8 $117.40 | Renesas Electronics Corporation | IC SRAM 4.5MBIT PAR 208CABGA | Tape & Reel (TR) | 208-CABGA (15x15) | Surface Mount | - | 0°C ~ 70°C (TA) |
![]() 70V7319S133BFI $155.36 | Renesas Electronics Corporation | IC SRAM 4.5MBIT PAR 208CABGA | Tray | 208-CABGA (15x15) | Surface Mount | - | -40°C ~ 85°C (TA) |
![]() 70V7319S133BFI8 $129.14 | Renesas Electronics Corporation | IC SRAM 4.5MBIT PAR 208CABGA | Tape & Reel (TR) | 208-CABGA (15x15) | Surface Mount | - | -40°C ~ 85°C (TA) |
![]() 70V7319S166BC $147.88 | Renesas Electronics Corporation | IC SRAM 4.5MBIT PAR 256CABGA | Tray | 256-CABGA (17x17) | Surface Mount | - | 0°C ~ 70°C (TA) |

Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
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Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
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In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
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[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
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In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
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Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
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In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
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In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
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On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
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