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— IC芯片 | 连接器 | 传感器 | 被动器件 —
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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| onsemi | ENGNXV08B260DZ1 | Bulk | - | - | |||
| onsemi | ENGNXV08B600DT1 | Bulk | - | - | |||
| onsemi | ENGNXV08H350XT14 | Bulk | - | - | |||
| onsemi | ENGNXV90HR03WS | Bulk | - | - | |||
![]() FAM65CR51ADZ2 $29.89 | onsemi | POWER INTEGRATED MODULE (PIM) BO | Tube | Through Hole | - | ||
![]() FAM65CR51AXZ1 $30.74 | onsemi | APM16 SF3 FRFET & SIC DIODE 51MO | Tube | Through Hole | - | ||
![]() FAM65CR51AXZ2 $30.74 | onsemi | APM16 SF3 FRFET & SIC DIODE 51MO | Tube | Through Hole | - | ||
![]() FAM65CR51DZ2 $17.51 | onsemi | POWER MODULE | Tube | Through Hole | - |

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