SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

This type of header contains male pins within a plastic base and is meant to be mated with a rectangular cable connector or a female socket header for board-to-board connection. These come in a variety of position and pitch options, with some having a breakaway option to manually change position count with ease. Some are shrouded with 1 to 4 walls or unshrouded. Mounting types include panel mount, board edge, stacking, surface mount, and through-hole.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() 10-88-1205 $1.31 | Molex | CONN HEADER R/A 20POS 2.54MM | Tube | Through Hole, Right Angle | C-Grid 70203 | - | |
![]() 10-88-1221 $1.20 | Molex | CONN HEADER VERT 22POS 2.54MM | Bulk | Through Hole | C-Grid 8624 | - | |
![]() 10-88-1225 $1.41 | Molex | CONN HEADER R/A 22POS 2.54MM | Tube | Through Hole, Right Angle | C-Grid 70203 | - | |
![]() 10-88-1241 $1.30 | Molex | CONN HEADER VERT 24POS 2.54MM | Bulk | Through Hole | C-Grid 8624 | - | |
![]() 10-88-1245 $1.52 | Molex | CONN HEADER R/A 24POS 2.54MM | Tube | Through Hole, Right Angle | C-Grid 70203 | - | |
![]() 10-88-1261 $1.39 | Molex | CONN HEADER VERT 26POS 2.54MM | Bulk | Through Hole | C-Grid 8624 | - | |
![]() 10-88-1265 $1.64 | Molex | CONN HEADER R/A 26POS 2.54MM | Tube | Through Hole, Right Angle | C-Grid 70203 | - | |
![]() 10-88-1281 $1.48 | Molex | CONN HEADER VERT 28POS 2.54MM | Bulk | Through Hole | C-Grid 8624 | - |
SL 22 240 10 GView Product
N2510-6003-RBView Product
ZSS-110-06-F-D-938View Product
TSW-116-07-G-D-024View Product
1722991108View Product
HTMS-107-53-T-D-SM-PView Product
A-WBP-L004EA-04TB03View Product
20021122-00098D8LFView Product
TSW-122-18-H-TView Product
TFM-105-02-L-D-K-TRView Product
MMT-118-01-L-DVView Product
MTSW-104-10-G-S-565View Product
Vishay Intertechnology, Inc., a global leader in discrete semiconductors and passive electronic components, has officially announced a price adjustment for its Metal-Oxide-Semiconductor Field-Effect Transistors…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read MoreA digital-to-analog converter (DAC) turns a digital number into an analog voltage or current. It lets a controller set a physical output, such as…
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read More
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
Read More