SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

IGBTs (Insulated Gate Bipolar Transistors) are multilayered semiconductor devices with three terminals that can handle high currents and have fast switching features. They are characterized by type, collector-emitter breakdown voltage, collector current, pulsed collector current, VCE(ON), switching energy, and gate charge.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() FF450R33T3E3B5BPSA1 $1,175.04 | Infineon Technologies | IGBT MOD 3300V 450A AGXHP100-6 | Tray | AG-XHP100-6 | Chassis Mount | XHP™3 | -40°C ~ 150°C |
![]() FF450R33T3E3B5P2BPSA1 $1,182.69 | Infineon Technologies | IHV IHM T XHP 3 3-6 5K | Tray | AG-XHP100-6 | Chassis Mount | XHP™3 | -40°C ~ 150°C (TJ) |
![]() FF450R33T3E3B5P3BPMA1 $1,190.34 | Infineon Technologies | IHV IHM T XHP 3 3-6 5K AG-XHP3K3 | Tray | AG-XHP3K33 | Chassis Mount | XHP™3 | -40°C ~ 150°C (TJ) |
| Infineon Technologies | IHV IHM T XHP 3 3-6 5K | Tray | AG-XHP100-6 | Chassis Mount | XHP™3 | -40°C ~ 150°C (TJ) | |
![]() FF450R33T3E3B5P4BPMA1 $1,197.99 | Infineon Technologies | IHV IHM T XHP 3 3-6 5K | Tray | AG-XHP100-6 | Chassis Mount | XHP™3 | -40°C ~ 150°C (TJ) |
![]() FF450R33T3E3B5P6BPMA1 $1,213.29 | Infineon Technologies | IHV IHM T XHP 3 3-6 5K | Tray | AG-XHP100-6 | Chassis Mount | XHP™3 | -40°C ~ 150°C (TJ) |
![]() FF450R33T3E3BPSA1 $1,090.55 | Infineon Technologies | IGBT MOD 3300V 450A AGXHP100-3 | Bulk,Tray | AG-XHP100-3 | Chassis Mount | XHP™3 | -40°C ~ 150°C |
![]() FF450R33T3E3P2BPSA1 $1,106.19 | Infineon Technologies | IGBT MOD 3300V 450A AGXHP100-3 | Tray | AG-XHP100-3 | Chassis Mount | XHP™3 | -40°C ~ 150°C |
APT13GP120KGView Product
NXH500B100H7Q2F2SHGView Product
IXBT12N300HVView Product
HGTG30N60A4DView Product
NGB8206NT4GView Product
IXA20PG1200DHG-TRRView Product
IXA40RG1200DHG-TRRView Product
FII40-06DView Product
IXA40PG1200DHG-TRRView Product
VS-GT55LA120UXView Product
CM200DX-24SView Product
NXH450B100H4Q2F2PGView Product
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read MoreA digital-to-analog converter (DAC) turns a digital number into an analog voltage or current. It lets a controller set a physical output, such as…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More
Choose an AC to DC converter by input range, output demand, isolation, efficiency and thermal derating. Compare architectures and check installation needs.
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More
See when an inductor behaves linearly, how DC bias and saturation reduce inductance, and which current and temperature curves to check.
Read More