SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

IGBTs (Insulated Gate Bipolar Transistors) are multilayered semiconductor devices with three terminals that can handle high currents and have fast switching features. They are characterized by type, collector-emitter breakdown voltage, collector current, pulsed collector current, VCE(ON), switching energy, and gate charge.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| IXYS | IGBT H BRIDGE 1700V 18A I4PAK5 | Tube | ISOPLUS i4-PAC™ | Through Hole | - | -55°C ~ 150°C (TJ) | |
| IXYS | IGBT H BRIDGE 1700V 18A I4PAK5 | Box | ISOPLUS i4-PAC™ | Through Hole | - | -55°C ~ 150°C (TJ) | |
| IXYS | IGBT H BRIDGE 1700V 18A I4PAK5 | Box | ISOPLUS i4-PAC™ | Through Hole | - | - | |
![]() FII30-06D $5.42 | IXYS | IGBT H BRIDGE 600V 30A I4PAK5 | Tube | ISOPLUS i4-PAC™ | Through Hole | - | -55°C ~ 150°C (TJ) |
| IXYS | IGBT H BRIDGE 1200V 33A I4PAK5 | Tube | ISOPLUS i4-PAC™ | Through Hole | - | -55°C ~ 150°C (TJ) | |
![]() FII40-06D $5.95 | IXYS | IGBT H BRIDGE 600V 40A I4PAK5 | Bulk | ISOPLUS i4-PAC™ | Through Hole | - | -55°C ~ 150°C (TJ) |
| IXYS | IGBT H BRIDGE 1200V 50A I4PAK5 | Tube | ISOPLUS i4-PAC™ | Through Hole | - | -55°C ~ 150°C (TJ) | |
| IXYS | IGBT NPT 1200V 50A ISOPLUS I4PAC | Tube | ISOPLUS i4-PAC™ | Through Hole | - | -55°C ~ 150°C (TJ) |
FZ1200R17HE4PHPSA1View Product
FMG2G300LS60EView Product
APTGT75TA120PGView Product
FZ1600R17KF6CB2S1NOSA1View Product
FII30-12EView Product
AOK30B65M2View Product
IXA30PG1200DHG-TUBView Product
FII24N17AH1View Product
IXGA24N120C3View Product
IXYH90N65A5View Product
IXA20PG1200DHG-TRRView Product
STGD3HF60HDT4View ProductWilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read MoreA digital-to-analog converter (DAC) turns a digital number into an analog voltage or current. It lets a controller set a physical output, such as…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More