SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

IGBTs (Insulated Gate Bipolar Transistors) are multilayered semiconductor devices with three terminals that can handle high currents and have fast switching features. They are characterized by type, collector-emitter breakdown voltage, collector current, pulsed collector current, VCE(ON), switching energy, and gate charge.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() APTGF100A120TG $53.21 | Microchip Technology | IGBT MODULE 1200V 135A 568W SP4 | Bulk | SP4 | Chassis Mount | - | - |
![]() APTGF100DA120T1G $27.55 | Microchip Technology | IGBT MODULE 1200V 130A 735W SP1 | Bulk | SP1 | Chassis Mount | - | - |
![]() APTGF100DA120TG $37.47 | Microchip Technology | IGBT MODULE 1200V 135A 568W SP4 | Bulk | SP4 | Chassis Mount | - | - |
![]() APTGF150A120T3AG $57.29 | Microchip Technology | IGBT MODULE 1200V 210A 1041W SP3 | Bulk | SP3 | Chassis Mount | - | - |
![]() APTGF150A120TG $69.62 | Microchip Technology | IGBT MODULE 1200V 200A 961W SP4 | Bulk | SP4 | Chassis Mount | - | - |
![]() APTGF150DU120TG $69.38 | Microsemi Corporation | IGBT MODULE 1200V 200A 961W SP4 | Bulk | SP4 | Chassis Mount | - | - |
![]() APTGF150H120G $130.05 | Microchip Technology | IGBT MODULE 1200V 200A 961W SP6 | Bulk | SP6 | Chassis Mount | - | - |
![]() APTGF15X120T3G $31.16 | Microsemi Corporation | IGBT MODULE 1200V 25A 140W SP3 | Bulk | SP3 | Chassis Mount | - | - |
STGW35NB60SView Product
IXA20PG1200DHG-TUBView Product
6MS30017E43W34404NOSA1View Product
FGHL75T65LQDTView Product
FII30-06DView Product
FZ900R12KP4HOSA1View Product
FS75R12KT4B11BPSA1View Product
HGTP3N60B3View Product
MMIX4B22N300View Product
VS-GB100LP120NView Product
IXYP24N100C4View Product
FII24N17AH1View Product
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
Understand how a comparator switches at a voltage threshold, why hysteresis prevents chatter, and which output and input specs matter.
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read More