SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

IGBTs (Insulated Gate Bipolar Transistors) are multilayered semiconductor devices with three terminals that can handle high currents and have fast switching features. They are characterized by type, collector-emitter breakdown voltage, collector current, pulsed collector current, VCE(ON), switching energy, and gate charge.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() FF300R07ME4B11BOSA1 $92.91 | Infineon Technologies | IGBT MOD 650V 390A 1100W | Bulk | Module | Chassis Mount | EconoDUAL™ 3 | -40°C ~ 150°C |
![]() FF300R07ME4B11BPSA1 $87.42 | Infineon Technologies | MEDIUM POWER ECONO | Tray | AG-ECONOD-3 | Chassis Mount | EconoDUAL™ 3 | -40°C ~ 150°C (TJ) |
![]() FF300R07ME4BOSA1 $87.42 | Infineon Technologies | GBT MODULE 650V 300A | Bulk,Tray | AG-ECONOD-3 | Chassis Mount | EconoDUAL™ 3 | -40°C ~ 150°C (TJ) |
![]() FF300R08W2P2B11ABOMA1 $57.56 | Infineon Technologies | EASY PACK AG-EASY2B-3 | Tray | AG-EASY2B-3 | Chassis Mount | EasyPACK™ | -40°C ~ 150°C (TJ) |
![]() FF300R12KE3B2HOSA1 $122.99 | Infineon Technologies | IGBT MOD 1200V 440A 1450W | Tray | Module | Chassis Mount | C | -40°C ~ 125°C |
![]() FF300R12KE3HOSA1 $122.99 | Infineon Technologies | IGBT MOD 1200V 440A 1450W | Tray | Module | Chassis Mount | C | -40°C ~ 125°C |
![]() FF300R12KE4B2HOSA1 $77.65 | Infineon Technologies | IGBT MOD 1200V 460A 1600W | Tray | Module | Chassis Mount | C | -40°C ~ 150°C |
![]() FF300R12KE4EHOSA1 $77.65 | Infineon Technologies | IGBT MOD 1200V 460A 1600W | Tray | Module | Chassis Mount | C | -40°C ~ 150°C |
STGF7NB60SLView Product
IXA30PG1200DHG-TRRView Product
FII24N17AH1SView Product
SGL60N90DG3YDTUView Product
VS-GT80DA60UView Product
IXA40RG1200DHG-TUBView Product
HGTG11N120CNView Product
IXGR50N60BD1View Product
STGSH80HB65DAGView Product
CM100TU-12FView Product
APTGL60DH120T3GView Product
NGTD13T120F2SWKView ProductThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
Read More
Compare RC, crystal and MEMS oscillator circuits. Check ppm, jitter, load capacitance, startup margin and output compatibility before choosing a clock source.
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read More
WILMINGTON, Mass. – August 11, 2026 — Analog Devices, Inc. (NASDAQ: ADI), the global leading supplier of high-performance analog, mixed-signal and digital signal processing…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read More
Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More